EC700 ARM-based Open-Source AI Edge Computing Industrial PC

The EC700 is a high-performance(8G RAM + 128GB eMMC) open-source ARM-based industrial PC, powered by the Rockchip RK3588J. Specifically designed for industrial AI visual inspection and large model deployment.

Edge Computing AI Industrial Computer





Protocol Support (Representative)
Modbus / OPC UA / EtherNet/IP / Siemens / Omron / MQTT / HTTP…
INTERFACE
RS485*2 / RS232*1 / DI*1 / DO*2 / USB3.0*4 / Type-C / HDMI / 3.5mm Audio/ LAN/ WAN
COMMUNICATION
LTE 4G, 5G, RJ45, WiFi

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Description

The EC700 is the latest generation of ARM-based Open-Source AI Edge Computing Industrial PC from the IOTRouter’s EC series. It is designed for “High-Performance Edge Computing + Simplified Industrial Development.”

Powered by the Rockchip RK3588J octa-core industrial processor (4× Cortex-A76 + 4× Cortex-A55), the EC700 comes standard with 8GB of RAM and 128GB of eMMC storage.

Capable of running two 35B-parameter large models simultaneously, the EC700 is the ideal solution for edge AI applications, including visual inspection, process optimization, and predictive maintenance.


Key Features

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Scalable AI Computing

6 TOPS NPU, expandable up to 320 TOPS with AI accelerators and large model inference

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Open System

Open Linux platform with SDK support for flexible secondary development

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Advanced Video Processing

8K video decoding and 4K encoding for AI vision applications

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Integrated Industrial Software

Node-RED, NeuronEX and FUXA for automation and industrial monitoring

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IT/OT Convergence

Bridge field devices, industrial networks and cloud platforms

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Industrial Reliability

-20~70°C operation with surge, ESD protection and fanless cooling

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Remote O&M

Configure, debug, and manage devices remotely

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Multi-Network Connectivity

4G/5G, Ethernet, and Wi-Fi with automatic failover

* Support OEM/ODM, contact customer service for details.


EC Series Products

The EC Series ARM Industrial Computers include three families: EC100 (RK3506J), EC300 (RK3562J), and EC700(RK3588J), offering different performance levels and hardware configurations. See the table below for details.

CategoryParameterEC100EC301EC500EC700
System ResourcesCPURK3506JRK3562JRK3572JRK3588J
Processor3 × Cortex-A74 × Cortex-A532*Cortex-A73
6*Cortex-A53
4*Cortex-A76
4*Cortex-A55
RAM512MB2GB4GB8GB
eMMC4GB16GB64GB128GB
GPUN/AMali-G52 2EEMali G310Mali G610 MC4
NPUN/A1 TOPS4Tops6 TOPS (Expandable)
SD Card SlotMicro SD Card SlotMicro SD Card SlotMicro SD Card SlotMicro SD Card Slot
SSDN/AM.2 NVMe SSD SlotM.2 NVMe SSD SlotM.2 NVMe SSD Slot
Operating SystemEmbedded LinuxEmbedded LinuxEmbedded LinuxEmbedded Linux
Wireless Communication4G/5GOptionalOptionalOptionalOptional
Wi-FiN/A
HaLow Wi-FiOptionalN/AN/AN/A
Network InterfaceGigabit EthernetN/A122
Fast Ethernet21N/AN/A
Communication InterfacesUSB 2.0N/A2N/AN/A
USB 3.0N/AN/A24
Debug InterfaceType-CType-CType-CType-C
LED4 (2 user-programmable)6 (4 user-programmable)6 (4 user-programmable)4 (0 user-programmable)
RS232N/A111
RS4852232
CAN22N/AN/A
Digital Input (DI)N/A221
Digital Output (DO)N/A222
Analog Input (AI)N/AN/A2N/A
Analog Output (AO)N/AN/A2N/A
MultimediaTouchscreenN/AN/AN/AN/A
HDMI OutputN/A✓ (1 Input / 1 Output)✓ (1 Input / 1 Output)
Audio OutputN/A3.5mm Earphone Jack3.5mm Earphone Jack3.5mm Earphone Jack
Hardware SpecificationsOperating Voltage9–36V9–36V9–36VDC12V
Operating Current75mA / 12V350mA / 12V-mA/12V3000mA/12V
CertificationCECECECCC
Operating Temperature-40~85°C-40~85°C-40~85°C-20~70℃
Software FeaturesRemote Maintenance
Remote Management
Node-RED
NeuronEX
Fuxa
Secondary Development
Open System

Quick Access to EC Series Products →


Flexible Expansion Elastic Upgrades

Standard configuration includes two M.2 PCle high-speed interfaces, supporting flexible configuration options for various computing modules and allowing for upgrades as needed. Maximum heterogeneous computing power reaches 320TOPS, supporting the simultaneous operation of two 35-byte large models.

lexible Expansion Elastic Upgradeslexible Expansion Elastic Upgrades-details

Full-Model Compatibility, Efficient Deployment

It covers the full range of LLM/VLM models from 1.5B to 35B, is compatible with mainstream deep learning frameworks, features end-to-endlow-latency multimodal inference, and is flexibly deployed based on Docker containers to adapt to diverse business scenarios.

Full-Model Compatibility, Efficient Deployment


Main Functions

Armor Protection

Armor Protection

The aluminum alloy enclosure with large cooling fins and direct-contact SoC heat dissipation design creates an efficient thermal path from the chip to the casing, ensuring stable operation under continuous workloads.

Integrated Audio-Visual Control

HDMI display output for real-time production visualization, plus a 3.5mm audio interface for equipment alerts and notifications, enabling smarter industrial monitoring and control.

Integrated Audio-Visual Control
Node-RED visual programming

Node-RED visual programming

Powered by Node-RED visual programming, EC700 enables rapid automation development with drag-and-drop workflow design, zero-code control strategy creation, and intelligent application deployment in minutes.

NeuronEX Protocol Hub Integration

With support for NeuronEX Industrial Protocol Hub, EC700 enables seamless connectivity to over 100 industrial protocols, high-frequency concurrent data acquisition, and flexible expansion through a modular driver architecture.

NeuronEX Protocol Hub Integration
Remote Management

Remote Management

Free remote operation and maintenance software supports remote management, diagnostics, configuration, and debugging, enabling efficient device maintenance and improved operational efficiency.


Comprehensive Device Management

EC700 industrial PC provides a comprehensive device management backend, supporting functions such as querying device operating status, network configuration, and firewall settings.

Comprehensive Device Management

Typical Use Cases of the EC700 Industrial PC

1. Deploy Advanced AI Vision and Intelligent Inspection Systems

Traditional industrial vision systems often rely on external computers or cloud-based processing, which can increase system complexity and introduce latency.

The EC700 provides high-performance edge computing with AI acceleration capability, enabling local AI inference for applications such as visual inspection, defect detection, quality analysis, and intelligent monitoring. It allows manufacturers to process vision data directly at the edge for faster response and improved system efficiency.

2. Run AI Models and Intelligent Applications at the Edge

Many industrial AI applications require powerful local computing to run models close to the data source while maintaining low latency and data privacy.

With its scalable AI computing architecture, the EC700 supports local deployment of AI models and intelligent applications. It provides a flexible platform for industrial AI scenarios such as predictive maintenance, intelligent decision support, and automated analysis without depending entirely on cloud computing.

3. Build High-Performance Industrial Computing Platforms

As industrial systems become more intelligent, traditional industrial computers may lack the computing capability required for advanced applications.

Based on an open ARM Linux platform, the EC700 provides a powerful foundation for developers and system integrators to build customized industrial solutions. It supports application deployment, software integration, and system expansion for demanding edge computing scenarios.

The Core Advantage

The EC700 combines high-performance ARM computing, scalable AI acceleration, open software capabilities, and industrial reliability in one platform.

Compared with traditional industrial computers, the EC700 provides the computing power and flexibility required for next-generation industrial AI applications, enabling manufacturers and system integrators to develop smarter, faster, and more scalable edge solutions.


FAQ

1. What makes EC700 different from a traditional industrial computer?

EC700 is a high-performance ARM-based industrial computer designed for demanding edge AI applications.

Built on an advanced ARM computing architecture, EC700 industrial PC provides significantly higher processing capability and AI acceleration performance compared with traditional industrial computers. Its powerful computing resources and expandable AI architecture make it suitable for advanced applications such as machine vision, intelligent inspection, and industrial AI analytics.

2. What AI models, frameworks, and deployment methods are supported by EC700?

EC700 industrial PC supports a wide range of AI models, including large language models (LLMs) such as Gemma-2B, Llama2-7B, Qwen2.5, Qwen3, and Qwen3.5, as well as vision-language models (VLMs) for multimodal AI applications.

It is compatible with mainstream AI frameworks such as TensorFlow, PyTorch, Caffe2, MXNet, PaddlePaddle, and ONNX, and supports flexible deployment through Docker containers.

3. Can developers customize applications on EC700?

Yes. EC700 is based on an open Embedded Linux platform and supports secondary development. Developers can deploy their own applications, integrate required software frameworks, and customize solutions for different industrial scenarios.


Product Size and Interfaces

EC700 Front Interface
EC700 Rear Interface
EC700 High-Performance Edge Computing ARM-based Open-Source industrial PC-5

Packing ListPacking list

Specification

ModelEC700
Core ConfigurationMain ProcessorRK3588RK3588J
4 × Cortex-A76 + 4 × Cortex-A55
RAM8 GB
Storage128 GB eMMC
Operating SystemEmbedded Linux
GPUMali G610 MC4
AI Performance6 TOPS (expandable, up to 320 TOPS)
Storage CardMicro SD slot
SSDM.2 NVMe SSD socket 【Form Factor: M.2 (2280) | Slot: M-Key | Interface: PCIe 3.0 + NVMe】
4G (Optional)ModuleQuectel Cat.4 (4G)
Frequency BandsLTE-FDD: B1/B3/B5/B8; LTE-TDD: B34/B38/B39/B40/B41; WCDMA: B1/B5/B8; GSM: 900 MHz / 1800 MHz
Transmit PowerLTE-TDD: Class 3 (23 dBm ±2 dB)
LTE-FDD: Class 3 (23 dBm ±2 dB)
WCDMA: Class 3 (24 dBm +1/-3 dB)
PCS1900 8-PSK: Class E2 (26 dBm ±3 dB)
DCS1800 8-PSK: Class E2 (26 dBm ±3 dB)
EGSM900 8-PSK: Class E2 (27 dBm ±3 dB)
GSM850 8-PSK: Class E2 (27 dBm ±3 dB)
PCS1900: Class 1 (30 dBm ±2 dB)
DCS1800: Class 1 (30 dBm ±2 dB)
EGSM900: Class 4 (33 dBm ±2 dB)
GSM850: Class 4 (33 dBm ±2 dB)
Bandwidth (theoretical)LTE-FDD: DL ≤150 Mbps, UL ≤50 Mbps; LTE-TDD: DL ≤130 Mbps, UL ≤30 Mbps
5G (Optional)ModuleQuectel 5G
Frequency Bands5G NR SA: n1/n28/n41/n77/n78/n79
5G NR NSA: n41/n78/n79
LTE-FDD: B1/B2/B3/B5/B7/B8/B20/B28
LTE-TDD: B34/B38/B39/B40/B41
WCDMA: B1/B2/B5/B8
Transmit Power5G NR n41/n78/n79 HPUE: Class 2 (26 dBm +2/-3 dB)
5G NR n77/n78/n79: Class 3 (23 dBm +2/-3 dB)
5G NR n28: Class 3 (23 dBm +2/-2.5 dB)
5G NR n1/n41: Class 3 (23 dBm +2 dB)
LTE B41 HPUE: Class 2 (26 dBm +2 dB)
LTE: Class 3 (23 dBm +2 dB)
WCDMA: Class 3 (23 dBm ±2 dB)
Bandwidth (theoretical)NSA: 2.2 Gbps (DL) / 575 Mbps (UL)
SA: 2 Gbps (DL) / 1 Gbps (UL)
LTE: 600 Mbps (DL) / 150 Mbps (UL)
Wi-Fi (Optional)Standard802.11a/b/g/n/ac/ax (Wi-Fi 6)
BandDual-band (2.4 GHz + 5 GHz)
ModeSTA + AP + Wi-Fi Direct concurrent
Max. Data Rate600.4 Mbps (20/40/80 MHz bandwidth)
TechnologySTBC, Beamforming, Wi-Fi 6 TWT, LDPC, MU-MIMO, OFDMA
SecurityWEP/WPA/WPA2/WPA3-SAE Personal, MFP
EthernetWAN1 × 10/100/1000 Mbps auto-negotiation
LAN1 × 10/100/1000 Mbps auto-negotiation
USBType-A 3.04 ports
Type-C1 port (debug interface)
RS232Ports1
TerminalRX, TX, GND
Baud Rate2400 – 921600 bps
Data Bits7, 8
Stop Bits1, 2
ParityNONE, EVEN, ODD
ProtectionESD, surge protection
RS485Ports2
TerminalA, B
Baud Rate2400 – 921600 bps
Data Bits7, 8
Stop Bits1, 2
ParityNONE, EVEN, ODD
ProtectionElectrical isolation, ESD, surge protection
DIPorts1
TerminalDIN+ × 1, DIN- × 1
Input TypeDry contact
ProtectionOptocoupler isolation, ESD, surge protection
DOPorts2
Output TypeRelay output
Load Capacity5 A @ 30 VDC; 5 A @ 250 VAC
LED IndicatorsLED4 (0 user-programmable)
MultimediaHDMI1 × IN + 1 × OUT
3.5 mm Audio Jack1 × IN + 1 × OUT
ElectricalCertificationCCC
Operating VoltageDC 12 V
Operating Current3000 mA @ 12 V
EnvironmentalOperating Temperature0–60 °C-20–70 °C
Storage Temperature0–60 °C-20–70 °C
Operating Humidity10%–90% RH (non-condensing)
Storage Humidity10%–90% RH (non-condensing)
MechanicalDimensions243 × 180 × 82 mm
Enclosure MaterialAluminum alloy profile
MountingWall-mount / Desktop
CoolingPassive
Reset ButtonPress 10 s to reset
EMCESDAir: Level 3 ±8 kV; Contact: Level 2 ±4 kV
SurgeLevel 2 ±1 kV
EFTLevel 2 ±1 kV
Software FeaturesNode-REDPre-installed (Node-RED 4.0)
NeuronEXPre-installed (NeuronEX-Lite)
Web SCADAPre-installed (FUXA)
Secondary DevelopmentSupported
Open SystemSupported

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